Why thin film patterned substrates are often the foundation for critical electronics in aerospace and defence systems.

Diamfab and other start-ups want to commercialize diamond wafers for demanding chip applications such as data centers, ...

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Partnership unites UWBG semiconductor & advanced packaging materials for HVDC grid technology to unlock massive power ...

Jackie Cucco is a senior testing editor at Travel + Leisure, where she plans product tests and writes/edits travel-related product reviews based on in-depth product testing. She previously worked as a ...

Abstract: Thin films of aluminium nitride (AlN) were successfully deposited using the High Power Impulse Magnetron Sputtering (HiPIMS) technique at room temperature. X-ray diffraction (XRD) analysis ...

Abstract: Scandium-doped aluminum nitride (AlScN) on insulator is a potential platform for realizing a diverse range of applications in photonic devices, due to its large piezoelectric effects, large ...

Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management Direct-cooled ...